The 14th Asian Thermophysical Properties Conference (ATPC2025) will be held in Shanghai from October 17th to 21th, 2025. The Asian Thermophysical Properties Conference, initiated in 1986 by Academician of the Chinese Academy of Sciences, Prof. Buxuan Wang and Prof. Seki of Japan, is held triennially and has been successfully hosted in China, Japan, South Korea, India, and other countries. The ATPC, the European Thermophysical Properties Conference, and the American Thermophysical Properties Conference are collectively known as the world's three major thermophysical properties conferences. The ATPC2025 will consist of Plenary Lectures, Keynote Lectures, Invited Lectures and Oral/poster Sessions. It will be the most influential academic conference in the Asian thermophysics field, attracting frontline researchers over 100 research institutes in Asia and even globally. Participants urgently require resources related to material preparation and characterization, computational tools for thermophysical properties, testing methods, and analytical instruments. In line with the principle of sustaining the conference through sponsorship, the organizing committee cordially invites outstanding enterprises to sponsor the event and promote industry exchange.  

I. Management Guidelines  
(1) Promotional Services Provided by the Conference  
　　Sponsorship Recognition: Sponsors will be acknowledged as supporting units of the conference.  
　　Conference Handbook Promotion: A dedicated page for corporate promotion in the conference handbook;
opportunities for product/technical presentations.  
　　Promotional Materials: Inclusion of corporate brochures and a LOGO link on the conference website.  
　　Exhibition Space: Dedicated exhibition area during the conference.  
　　Registration Discounts: Exemption from registration fee for 1-6 participants.   
(2) Eligibility Criteria for Sponsors  
　　Sponsors and their products/services must be related to material preparation, characterization, thermophysical property testing, or associated fields.  　
　　Sponsors must maintain a positive social reputation.  
(3) Sponsorship Forms        
　　Financial contributions only.  
(4) Sponsorship Confirmation  
　　The organizing committee will sign a sponsorship agreement with sponsors to clarify terms, amounts, payment methods, rights, and obligations.  
　　Financial sponsorship is confirmed upon receipt of payment; other forms follow agreed delivery and acceptance protocols.  
II. Sponsorship Tiers  
(1) Diamond Sponsorship (CNY 120,000)  
　　Benefits:  
　　Logo link on the official conference website; priority placement for technical presentations.  
　　Prime exhibition location and largest booth space during the conference.  
　　Full-page advertisement on the inside front or back cover of the conference handbook.  
　　Corporate brochure included in conference materials.  
　　Recognition as a top-tier supporting sponsor.  
　　Exemption from registration fee for 6 participants.
(2) Platinum Sponsorship (CNY 90,000)  
　　Benefits:  
　　Logo link on the official website; opportunity for technical presentations.  
　　Premium exhibition space and booth size.  
　　Full-page advertisement in the conference handbook.  
　　Corporate brochure included in conference materials.  
　　Recognition as a supporting sponsor.  
　　Exemption from registration fee for 5 participants.
(3) Gold Sponsorship (CNY 70,000)  
　　Benefits:
　　Dedicated exhibition space; opportunity for technical presentations.  
　　Corporate brochure included in conference materials.  
　　Recognition as a supporting sponsor.  
　　Exemption from registration fee for 3 participants.  
(4) Silver Sponsorship (CNY 50,000)  
　　Benefits:
　　Exhibition space during the conference.  
　　Promotional flyer included in conference materials.  
　　Recognition as a supporting sponsor.  
　　Exemption from registration fee for 2 participants.  
(5) Bronze Sponsorship (CNY 20,000)  
　　Benefits:
　　Promotional flyer included in conference materials.  
　　Recognition as a supporting sponsor.  
　　Exemption from registration fee for 1 participant.

　　Contact for Sponsorship Inquiries  
　　Prof. Wu: +86-13585748632